400 Points Soldless Breadboard

The 400 Points Soldless Breadboard is a half-size solderless breadboard for building and testing small circuits without soldering. Push components and jumper wires into the holes, test your idea, then pull them out and reuse the board. Its compact size is ideal for Arduino Nano and ESP32 projects, sensor tests and student kits.

400 Points Soldless Breadboard Specifications

• Tie points: 400 in total
• Terminal strip: 300 tie points in rows of 5, split by a centre channel for DIP ICs
• Power rails: 4 distribution strips with 100 tie points, 2 on each side
• Hole pitch: 2.54 mm (0.1 in), standard for headers and DIP packages
• Wire size: accepts solid jumper wire and component leads, about 20–29 AWG

400 Points Soldless Breadboard Applications

• Small Arduino, ESP32 and sensor circuits
• Testing ICs, LEDs and buttons before soldering
• Plug-in boards for STEM kits and classrooms
• Extra space next to a larger breadboard

What's in the Box

• 1 × 400-point solderless breadboard

Tip: Holes in the same row of 5 are connected to each other, but the two halves of the board are not. Place DIP ICs across the centre channel so each pin gets its own row.

Orders placed before 14:00 are ready for pickup the same day. Delivery across Lebanon usually takes 1–3 working days.