830 Points Soldless Breadboard

The 830 Points Soldless Breadboard is a full-size solderless breadboard for building and testing circuits without soldering. Push components and jumper wires into the holes, try your idea, and pull them out to reuse the board again and again. It fits Arduino, ESP32 and Raspberry Pi projects, DIP ICs and most through-hole parts.

830 Points Soldless Breadboard Specifications

• Tie points: 830 in total
• Terminal strip: 630 tie points in rows of 5, split by a centre channel for DIP ICs
• Power rails: 4 distribution strips with 200 tie points, 2 on each side
• Hole pitch: 2.54 mm (0.1 in), standard for headers and DIP packages
• Wire size: accepts solid jumper wire and component leads, about 20–29 AWG
• Size: approx. 165 × 55 mm

830 Points Soldless Breadboard Applications

• Prototyping Arduino, ESP32 and Raspberry Pi circuits
• Testing sensors, LEDs, buttons and ICs before soldering a PCB
• Electronics classes, STEM labs and university projects
• Quick repairs and experiments on the workbench

What's in the Box

• 1 × 830-point solderless breadboard

Tip: Check whether the power rails on your board are split in the middle; if they are, bridge the two halves with a short jumper wire so the whole rail carries power.

Orders placed before 14:00 are ready for pickup the same day. Delivery across Lebanon usually takes 1–3 working days.