840 Points GL-12 Soldless Breadboard

The 840 Points GL-12 Soldless Breadboard is a large solderless breadboard for building and testing circuits without a soldering iron. It offers 840 tie points, a little more room than the common 830-point board, so a microcontroller, several ICs and sensors fit on one board. Components and jumper wires push in and pull out, so the board can be reused for project after project.

840 Points GL-12 Soldless Breadboard Specifications

• Model: GL-12
• Tie points: 840 in total
• Terminal area: 640 tie points in rows of 5, split by a centre channel for DIP ICs
• Power rails: 200 tie points along the long edges, marked red (+) and blue (–)
• Hole pitch: 2.54 mm (0.1 in), standard for headers and DIP packages
• Wire: solid-core jumper wire and component leads, 22 AWG fits best

840 Points GL-12 Soldless Breadboard Applications

• Prototyping Arduino, ESP32 and Raspberry Pi circuits
• Testing sensors, displays and logic ICs before making a PCB
• Electronics classes, STEM labs and university projects
• Larger builds that do not fit on a half-size breadboard

What's in the Box

• 1 × GL-12 840-point solderless breadboard

Tip: Check whether the power rails are split in the middle (look for a gap in the red and blue lines); if they are, bridge the two halves with short jumper wires so power reaches the full length of the board.

Orders placed before 14:00 are ready for pickup the same day. Delivery across Lebanon usually takes 1–3 working days.